LED lamp has environmental protection, long life, small volume, high directivity, solid form is not easy to damage ... Etc., have gradually replaced the traditional tungsten filament lamp ( incandescent), CCFL fluorescent lamp, but in response to the different application requirements
LED component emitting characteristics, efficiency is the key to the base material and the wafer growth technology differences.
Strengthen the packaging technology to improve the light efficiency and light type
Observation of the common high power LED bulbs technology, can be divided into the single chip package, integrated multi-chip package and chip encapsulation 3 kinds of techniques, and through the packaging technology optimization, can improve the LED chip light emitting efficiency, heat dissipation effect and the reliability of the product.